Teramount changes the world of optical connectivity by offering a novel solution for connecting optics to silicon. One of the main challenges of next-generation data center optical connectivity is scalability of fiber-to-chip connectivity – the ability to reliably connect hundreds of fibers to a single chip at high yield and low cost. Teramount Photonic-plug technology has demonstrated a 100X improved tolerance in assembling fiber to silicon chip compared to existing technologies, enabling successful integration of optics with silicon and scalable deployment of silicon photonics. With this, Teramount is solving a major obstacle of next-generation high speed and low power semiconductor connectivity for various datacom and telecom markets.